Film/Wafer Mounters
ULTRON WAFER BACKGRINDING PROTECTIVE FILM REMOVER
Wafer Backgrinding Protective-Film Remover
Up to 6" wafer size
Semiconductor Assembly Equipment
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Manual Eutectic Die Bonders
MECH-EL EUTECTIC DIE BONDER
The Mech-El/MEI 709 is a manual eutectic die attacher. The machine comes with a 2 position slide table for die presentation and heated work holder. The MEI 709 uses a unique hot gas head that allows the user to heat the package to a temperature below the wetting temperature of the solder and use the hot gas to bring the localized heat to only the die area to wet the solder or perform.
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Other Assembly / Hybrid
AQUEOUS TECHNOLOGIES ULTRASONIC STENCIL CLEANING SYSTEM
Ultrasonic Stencil Cleaning System
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Automatic Wedge Bonders
F&K DELVOTEC AUTOMATIC WEDGE BONDER
Automatic Wedge Bonder
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Manual Ball Bonders
KULICKE & SOFFA K&S MANUAL BALL BONDER
Manual Ball Bonder
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Manual Wedge Bonders
KULICKE & SOFFA K&S MANUAL WEDGE BONDER
Manual Wedge Bonder with Leica MZ6 Microscope
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Manual Wedge Bonders
KULICKE & SOFFA K&S MANUAL WEDGE BONDER
Manual Wedge Bonder with Leica GZ6 Microscope
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Film/Wafer Mounters
LONGHILL INDUSTRIES WAFER MOUNTER
Wafer Mounter Longhill Industries LH 832
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Dicing Saws
DISCO DICING SAW, 6"
Dicing Saw Disco DAD 320
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Dispensing/Coating Equipment
CAMALOT/SPEEDLINE DISPENSING SYSTEM
Dispensing System Camalot/Speedline model 1818
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Dispensing/Coating Equipment
SEALANT EQUIPMENT & ENGINEERING DISPENSE SYSTEM
Positive Displacement Dispense System
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Automatic Wedge Bonders
WEST-BOND AUTOMATIC WEDGE BONDER
Automatic Wedge Bonder Designed for RF,microwave and high-lead count semiconductor devicesBonds ultrasonically or thermosonically